A ranar 13 ga Satumba, 2024, Resonac ya ba da sanarwar gina sabon ginin samarwa don SiC (silicon carbide) wafers don wutar lantarki a Shuka Yamagata a cikin garin Higashine, Yamagata Prefecture. Ana sa ran kammalawar a kashi na uku na 2025.
Sabon ginin zai kasance a cikin Yamagata Plant na reshensa, Resonac Hard Disk, kuma zai kasance da filin gini na murabba'in mita 5,832. Zai samar da wafers na SiC (substrates da epitaxy). A cikin Yuni 2023, Resonac ya sami takaddun shaida daga Ma'aikatar Tattalin Arziƙi, Ciniki da Masana'antu a matsayin wani ɓangare na shirin tabbatar da wadatar kayayyaki don mahimman kayan da aka tsara a ƙarƙashin Dokar Inganta Tsaron Tattalin Arziƙi, musamman don kayan semiconductor (SiC wafers). Shirin tabbatar da samar da kayayyaki wanda Ma'aikatar Tattalin Arziki, Ciniki da Masana'antu ta amince da shi yana buƙatar zuba jari na yen biliyan 30.9 don ƙarfafa ƙarfin samar da wafer na SiC a sansanonin da ke birnin Oyama, lardin Tochigi; Hikone City, Shiga Prefecture; Birnin Higashine, yankin Yamagata; da Ichihara City, Chiba Prefecture, tare da tallafin da ya kai yen biliyan 10.3.
Shirin shine fara samar da wafers na SiC (substrates) ga Oyama City, Hikone City, da Higashine City a cikin Afrilu 2027, tare da ƙarfin samarwa na shekara-shekara na guda 117,000 (daidai da inci 6). An shirya samar da wafers na SiC epitaxial wafers zuwa Garin Ichihara da Higashine City a watan Mayu 2027, tare da sa ran iya aiki na shekara-shekara na guda 288,000 (ba a canzawa).
A ranar 12 ga Satumba, 2024, kamfanin ya gudanar da bikin kaddamar da ginin a wurin da ake shirin ginawa a tashar Yamagata.
Lokacin aikawa: Satumba-16-2024