Marufi na Semiconductor ya samo asali daga ƙirar PCB na 1D na al'ada zuwa haɗaɗɗen nau'ikan nau'ikan nau'ikan 3D a matakin wafer. Wannan ci gaban yana ba da damar tazarar haɗin haɗin kai a cikin kewayon micron mai lamba ɗaya, tare da bandwidth na har zuwa 1000 GB/s, yayin da yake riƙe ingantaccen ƙarfin kuzari. A ainihin fasahar marufi na semiconductor na ci gaba shine marufi na 2.5D (inda aka sanya abubuwan da aka gyara gefe da gefe a kan madaidaicin Layer) da marufi na 3D (wanda ya haɗa da tattara kwakwalwan kwamfuta a tsaye a tsaye). Waɗannan fasahohin suna da mahimmanci ga makomar tsarin HPC.
Fasahar fakitin 2.5D ta ƙunshi nau'ikan kayan Layer na tsaka-tsaki daban-daban, kowannensu yana da fa'ida da rashin amfanin sa. Silicon (Si) yadudduka na tsaka-tsaki, gami da cikakkiyar wafern siliki mai ɗorewa da gadajen siliki na gida, an san su don samar da mafi kyawun damar wayoyi, yana mai da su manufa don ƙididdige ƙima. Duk da haka, suna da tsada ta fuskar kayan aiki da masana'antu da kuma iyakokin fuskantar a yankin marufi. Don magance waɗannan batutuwa, amfani da gadojin siliki na gida yana ƙaruwa, yin amfani da dabarar siliki inda kyakkyawan aiki ke da mahimmanci yayin magance matsalolin yanki.
Yadudduka na tsaka-tsakin yanayi, ta amfani da robobin da aka ƙera fan-fita, sun kasance madadin siliki mai tsadar gaske. Suna da ƙananan dielectric akai-akai, wanda ke rage jinkirin RC a cikin kunshin. Duk da waɗannan fa'idodin, matakan tsaka-tsakin kwayoyin halitta suna kokawa don cimma matakin raguwar fasalin haɗin kai kamar marufi na tushen silicon, yana iyakance ɗaukar su cikin aikace-aikacen kwamfuta masu inganci.
Gilashin tsaka-tsakin gilashi sun sami sha'awa mai mahimmanci, musamman biyo bayan ƙaddamar da fakitin abin hawa na gilashin kwanan nan na Intel. Gilashi yana ba da fa'idodi da yawa, kamar daidaitawar haɓakar haɓakar thermal (CTE), babban kwanciyar hankali, santsi da lebur, da ikon tallafawa masana'antar panel, yana mai da shi ɗan takara mai ban sha'awa don yadudduka na tsaka-tsaki tare da damar wayoyi masu kama da silicon. Koyaya, baya ga ƙalubalen fasaha, babban koma baya na matakan tsaka-tsakin gilashin shine tsarin yanayin da bai balaga ba da kuma rashin babban ƙarfin samarwa a halin yanzu. Yayin da yanayin yanayin ke girma kuma ƙarfin samarwa ya inganta, fasahar tushen gilashi a cikin marufi na semiconductor na iya ganin ƙarin girma da karɓuwa.
Dangane da fasaha na marufi na 3D, Cu-Cu-ƙasa-ƙasa haɗin haɗin kai yana zama jagorar sabbin fasaha. Wannan fasaha ta ci gaba tana samun haɗin kai na dindindin ta hanyar haɗa kayan aikin dielectric (kamar SiO2) tare da ƙarafa (Cu). Cu-Cu matasan haɗin gwiwa na iya cimma tazara ƙasa da microns 10, yawanci a cikin kewayon micron mai lamba ɗaya, wanda ke wakiltar babban ci gaba akan fasahar ƙaramar ƙarami ta gargajiya, wacce ke da tazara ta kusan 40-50 microns. Fa'idodin haɗin gwiwar matasan sun haɗa da haɓaka I / O, haɓaka bandwidth mai haɓakawa, ingantaccen stacking na tsaye na 3D, ingantaccen ƙarfin ƙarfi, da rage tasirin parasitic da juriya na thermal saboda rashin cika ƙasa. Duk da haka, wannan fasaha yana da wuyar ƙira kuma yana da farashi mai yawa.
2.5D da fasahar marufi na 3D sun ƙunshi dabaru daban-daban na marufi. A cikin marufi na 2.5D, dangane da zaɓi na kayan aikin tsaka-tsaki, ana iya rarraba shi zuwa tushen siliki, tushen tushen, da matakan tsaka-tsaki na tushen gilashi, kamar yadda aka nuna a cikin adadi a sama. A cikin marufi na 3D, haɓaka fasahar micro-bump yana da nufin rage girman tazara, amma a yau, ta hanyar ɗaukar fasahar haɗin kai (hanyar haɗin kai tsaye ta Cu-Cu), ana iya samun ma'aunin tazara mai lamba ɗaya, yana nuna babban ci gaba a fagen. .
** Mahimman Hanyoyin Fasaha don Kallon: ***
1. ** Manyan Yankunan Matsakaicin Matsakaici:** IDTechEx a baya an annabta cewa saboda wahalar siliki tsaka-tsakin yadudduka da suka wuce iyakar girman girman reticle 3x, mafitacin gadar silicon 2.5D zai maye gurbin siliki tsaka-tsakin yadudduka azaman zaɓi na farko don ɗaukar kwakwalwan kwamfuta na HPC. TSMC shine babban mai siyar da siliki na 2.5D don NVIDIA da sauran manyan masu haɓaka HPC kamar Google da Amazon, kuma kamfanin kwanan nan ya sanar da samar da yawan jama'a na ƙarni na farko na CoWoS_L tare da girman reticle 3.5x. IDTechEx yana tsammanin wannan yanayin zai ci gaba, tare da ƙarin ci gaba da aka tattauna a cikin rahoton sa wanda ya shafi manyan 'yan wasa.
2. ** Marufi-Level Packaging:** Marufi matakin panel ya zama wani gagarumin mayar da hankali, kamar yadda aka haskaka a 2024 Taiwan International Semiconductor Nunin. Wannan hanyar tattarawa tana ba da damar yin amfani da manyan yadudduka na tsaka-tsaki kuma yana taimakawa rage farashi ta hanyar samar da ƙarin fakiti lokaci guda. Duk da yuwuwar sa, har yanzu akwai buƙatar magance ƙalubale kamar sarrafa shafukan yaƙi. Ƙaramar shahararta tana nuna haɓakar buƙatu na manyan yadudduka masu tsada.
3. ** Gilashin Tsakanin Tsakanin Gilashin: ** Gilashi yana fitowa a matsayin kayan dan takara mai karfi don cimma kyakkyawan wayoyi, kwatankwacin siliki, tare da ƙarin fa'ida kamar CTE daidaitacce da ingantaccen aminci. Gilashin tsaka-tsakin yadudduka kuma sun dace da marufi-matakin panel, suna ba da damar yin amfani da wayoyi masu yawa a ƙarin ƙimar sarrafawa, yana mai da shi mafita mai ban sha'awa ga fasahar marufi na gaba.
4. **HBM Hybrid Bonding:** 3D jan karfe-Copper (Cu-Cu) haɗin haɗin gwiwa shine mabuɗin fasaha don cimma haɗin kai tsakanin kwakwalwan kwamfuta masu kyau. An yi amfani da wannan fasaha a cikin samfuran uwar garken masu tsayi daban-daban, gami da AMD EPYC don Stacked SRAM da CPUs, da kuma tsarin MI300 don tara tubalan CPU/GPU akan I/O ya mutu. Haɗin kai ana tsammanin zai taka muhimmiyar rawa a ci gaban HBM na gaba, musamman don tarin DRAM da ya wuce 16-Hi ko 20-Hi.
5. **Co-Packaged Optical Devices (CPO):** Tare da karuwar bukatar samar da bayanai masu yawa da ingancin wutar lantarki, fasahar haɗin kai ta gani ta sami kulawa sosai. Na'urorin gani da aka haɗa tare (CPO) suna zama mafita mai mahimmanci don haɓaka bandwidth na I/O da rage yawan kuzari. Idan aka kwatanta da watsa wutar lantarki na gargajiya, sadarwa ta gani tana ba da fa'idodi da yawa, gami da ƙaramar sigina a kan nesa mai nisa, rage jin daɗin magana, da ƙara yawan bandwidth. Waɗannan fa'idodin sun sa CPO ya zama zaɓi mai kyau don ingantaccen bayanai, tsarin HPC mai ƙarfi mai ƙarfi.
** Kasuwannin Maɓalli don Kallon: ***
Kasuwa ta farko wacce ke haɓaka haɓakar fasahar tattara kayan 2.5D da 3D babu shakka ɓangaren sarrafa kwamfuta mai girma (HPC). Waɗannan hanyoyin tattara kayan haɓaka suna da mahimmanci don shawo kan iyakokin Dokar Moore, ba da damar ƙarin transistor, ƙwaƙwalwar ajiya, da haɗin kai a cikin fakiti ɗaya. Rushewar kwakwalwan kwamfuta kuma yana ba da damar mafi kyawun amfani da nodes na tsari tsakanin tubalan aiki daban-daban, kamar raba tubalan I/O daga tubalan sarrafawa, ƙara haɓaka aiki.
Baya ga manyan kwamfyutoci (HPC), ana kuma sa ran sauran kasuwanni za su sami ci gaba ta hanyar amfani da fasahar tattara kaya. A cikin sassan 5G da 6G, sabbin abubuwa irin su eriya na tattarawa da ɓangarorin guntu na yanke za su tsara makomar gine-ginen hanyar sadarwa mara waya (RAN). Motoci masu cin gashin kansu kuma za su amfana, yayin da waɗannan fasahohin ke tallafawa haɗaɗɗun ɗakunan firikwensin firikwensin da na'urorin ƙididdiga don aiwatar da adadi mai yawa na bayanai yayin tabbatar da aminci, aminci, ƙaƙƙarfan ƙarfi, sarrafa wutar lantarki da yanayin zafi, da ƙimar farashi.
Kayan lantarki na mabukaci (ciki har da wayoyi, smartwatches, na'urorin AR/VR, PC, da wuraren aiki) suna ƙara mai da hankali kan sarrafa ƙarin bayanai a cikin ƙananan wurare, duk da fifikon farashi. Babban fakitin semiconductor zai taka muhimmiyar rawa a cikin wannan yanayin, kodayake hanyoyin marufi na iya bambanta da waɗanda aka yi amfani da su a cikin HPC.
Lokacin aikawa: Oktoba-25-2024