Marufi na Semiconductor ya samo asali daga ƙirar gargajiya ta 1D PCB zuwa haɗin 3D na zamani a matakin wafer. Wannan ci gaban yana ba da damar haɗa tazara a cikin kewayon micron mai lamba ɗaya, tare da bandwidth har zuwa 1000 GB/s, yayin da yake kiyaye ingantaccen makamashi mai yawa. A cikin fasahar marufi na semiconductor na ci gaba akwai marufi na 2.5D (inda aka sanya kayan aiki gefe da gefe akan wani matakin tsakiya) da marufi na 3D (wanda ya haɗa da tara kwakwalwan aiki a tsaye). Waɗannan fasahohin suna da mahimmanci ga makomar tsarin HPC.
Fasahar marufi ta 2.5D ta ƙunshi nau'ikan kayan tsaka-tsaki daban-daban, kowannensu yana da nasa fa'idodi da rashin amfani. Matakan tsakiya na Silicon (Si), gami da wafers ɗin silicon masu aiki da kuma gadojin silicon na gida, an san su da samar da mafi kyawun damar wayoyi, wanda hakan ya sa suka dace da kwamfuta mai aiki mai kyau. Duk da haka, suna da tsada dangane da kayan aiki da masana'antu kuma suna fuskantar ƙuntatawa a yankin marufi. Don rage waɗannan matsalolin, amfani da gadojin silicon na gida yana ƙaruwa, yana amfani da dabarar amfani da silicon inda aiki mai kyau yake da mahimmanci yayin magance ƙuntatawa na yanki.
Matakan tsaka-tsaki na halitta, waɗanda ke amfani da robobi da aka ƙera ta hanyar fan, su ne madadin silicon mai rahusa. Suna da ƙarancin ma'aunin dielectric, wanda ke rage jinkirin RC a cikin fakitin. Duk da waɗannan fa'idodin, matakan tsaka-tsaki na halitta suna fama da cimma matakin rage fasalin haɗin kai kamar marufi na silicon, wanda ke iyakance amfani da su a aikace-aikacen kwamfuta mai aiki mai girma.
Manyan layukan gilashi sun sami babban sha'awa, musamman bayan ƙaddamar da na'urar gwajin marufi ta hanyar gwaji ta Intel kwanan nan. Gilashin yana ba da fa'idodi da yawa, kamar daidaitawa coefficient of thermal expansion (CTE), kwanciyar hankali mai girma, santsi da faɗi, da kuma ikon tallafawa kera bangarori, wanda hakan ya sa ya zama ɗan takara mai kyau ga layukan tsakiya tare da ƙarfin wayoyi kamar silicon. Duk da haka, ban da ƙalubalen fasaha, babban koma-baya na layukan tsakiya na gilashi shine yanayin ƙasa mara kyau da rashin ƙarfin samarwa mai yawa a yanzu. Yayin da yanayin ƙasa ke girma kuma ƙarfin samarwa ke inganta, fasahar gilashi a cikin marufi na semiconductor na iya ganin ƙarin ci gaba da karɓuwa.
Dangane da fasahar marufi ta 3D, haɗin Cu-Cu mara bump-less hybrid yana zama babbar fasaha mai ƙirƙira. Wannan fasaha mai ci gaba tana cimma haɗin kai na dindindin ta hanyar haɗa kayan dielectric (kamar SiO2) da ƙarfe da aka haɗa (Cu). Haɗin Cu-Cu na hybrid na iya cimma tazara a ƙasa da microns 10, yawanci a cikin kewayon micron mai lamba ɗaya, wanda ke wakiltar babban ci gaba akan fasahar micro-bump ta gargajiya, wacce ke da tazara ta kusan microns 40-50. Fa'idodin haɗin hybrid sun haɗa da ƙaruwar I/O, haɓaka bandwidth, ingantaccen stacking na tsaye na 3D, ingantaccen ingantaccen amfani da wutar lantarki, da rage tasirin parasites da juriyar zafi saboda rashin cika ƙasa. Duk da haka, wannan fasaha tana da sarkakiya don ƙera kuma tana da farashi mai girma.
Fasahar marufi ta 2.5D da 3D ta ƙunshi dabarun marufi daban-daban. A cikin marufi ta 2.5D, dangane da zaɓin kayan Layer na tsakiya, ana iya rarraba shi zuwa layukan tsakiya na tushen silicon, na tushen organic, da na gilashi, kamar yadda aka nuna a cikin hoton da ke sama. A cikin marufi ta 3D, haɓaka fasahar micro-bump yana da nufin rage girman sarari, amma a yau, ta hanyar amfani da fasahar haɗin gwiwa (hanyar haɗin Cu-Cu kai tsaye), ana iya cimma girman tazara mai lambobi ɗaya, wanda ke nuna babban ci gaba a fagen.
**Manyan Abubuwan Fasaha da Ya Kamata Ku Kalli:**
1. **Manyan Yankunan Tsaka-tsaki na Tsaka-tsaki:** IDTechEx a baya ya annabta cewa saboda wahalar da layukan tsakiya na silicon suka wuce iyaka girman reticle 3x, mafita na gadar silicon 2.5D nan ba da jimawa ba za su maye gurbin layukan tsakiya na silicon a matsayin babban zaɓi don marufi kwakwalwan HPC. TSMC babban mai samar da layukan tsakiya na silicon 2.5D ne ga NVIDIA da sauran manyan masu haɓaka HPC kamar Google da Amazon, kuma kwanan nan kamfanin ya sanar da samar da yawa na CoWoS_L na ƙarni na farko tare da girman reticle 3.5x. IDTechEx yana tsammanin wannan yanayin zai ci gaba, tare da ƙarin ci gaba da aka tattauna a cikin rahotonsa wanda ya shafi manyan 'yan wasa.
2. **Marufi Matakin Faifan:** Marufi matakin faifan ya zama babban abin da aka fi mayar da hankali a kai, kamar yadda aka nuna a bikin baje kolin Semiconductor na kasa da kasa na Taiwan na 2024. Wannan hanyar marufi tana ba da damar amfani da manyan yadudduka na tsaka-tsaki kuma tana taimakawa wajen rage farashi ta hanyar samar da ƙarin faifan a lokaci guda. Duk da yuwuwarta, har yanzu ana buƙatar magance ƙalubale kamar sarrafa shafukan yaƙi. Ƙaruwar shahararsa tana nuna ƙaruwar buƙatar manyan yadudduka masu tsaka-tsaki masu inganci da araha.
3. **Layukan Tsaka-tsaki na Gilashi:** Gilashi yana fitowa a matsayin kayan aiki mai ƙarfi don cimma wayoyi masu kyau, waɗanda suka yi daidai da silicon, tare da ƙarin fa'idodi kamar CTE mai daidaitawa da aminci mafi girma. Layukan tsaka-tsaki na gilashi kuma suna dacewa da marufi na matakin allo, suna ba da damar yin wayoyi masu yawa a farashi mai sauƙi, wanda hakan ya sa ya zama mafita mai kyau ga fasahar marufi na gaba.
4. **Haɗin Haɗin HBM:** Haɗin haɗin jan ƙarfe da jan ƙarfe (Cu-Cu) na 3D babbar fasaha ce don cimma haɗin kai tsaye tsakanin kwakwalwan kwamfuta. An yi amfani da wannan fasaha a cikin samfuran sabar daban-daban masu inganci, gami da AMD EPYC don SRAM da CPUs masu tarin yawa, da kuma jerin MI300 don tara tubalan CPU/GPU akan ma'aunin I/O. Ana sa ran haɗin haɗin gwiwa zai taka muhimmiyar rawa a ci gaban HBM na gaba, musamman ga tarin DRAM da suka wuce layuka 16-Hi ko 20-Hi.
5. **Na'urorin gani masu haɗin gwiwa (CPO):** Tare da ƙaruwar buƙatar samar da bayanai masu yawa da ingantaccen amfani da wutar lantarki, fasahar haɗin kai ta gani ta sami kulawa sosai. Na'urorin gani masu haɗin gwiwa (CPO) suna zama babban mafita don haɓaka bandwidth na I/O da rage amfani da makamashi. Idan aka kwatanta da watsa wutar lantarki ta gargajiya, sadarwa ta gani tana ba da fa'idodi da yawa, gami da rage rage sigina a tsawon nisa, rage saurin amsawa, da kuma ƙaruwar bandwidth sosai. Waɗannan fa'idodin sun sa CPO ya zama zaɓi mafi kyau ga tsarin HPC mai yawan bayanai da ingantaccen makamashi.
**Kasuwannin da za a Kalla:**
Babban kasuwa da ke haifar da haɓaka fasahar marufi ta 2.5D da 3D babu shakka ita ce ɓangaren kwamfuta mai aiki sosai (HPC). Waɗannan hanyoyin marufi na zamani suna da mahimmanci don shawo kan iyakokin Dokar Moore, suna ba da damar ƙarin transistor, ƙwaƙwalwa, da haɗin kai a cikin fakiti ɗaya. Rushewar guntu kuma yana ba da damar amfani da mafi kyawun hanyoyin aiki tsakanin tubalan aiki daban-daban, kamar raba tubalan I/O daga tubalan sarrafawa, ƙara haɓaka inganci.
Baya ga manyan ayyuka na kwamfuta (HPC), ana kuma sa ran wasu kasuwanni za su samu ci gaba ta hanyar amfani da fasahar marufi ta zamani. A fannoni na 5G da 6G, sabbin abubuwa kamar eriya na marufi da mafita na guntu na zamani za su tsara makomar tsarin hanyoyin sadarwa mara waya (RAN). Motocin da ke cin gashin kansu za su amfana, domin waɗannan fasahohin suna tallafawa haɗakar na'urori masu auna firikwensin da na'urorin kwamfuta don sarrafa bayanai masu yawa yayin da suke tabbatar da aminci, aminci, ƙanƙantawa, sarrafa wutar lantarki da zafi, da kuma inganci.
Kayan lantarki na masu amfani (gami da wayoyin komai da ruwanka, agogon hannu, na'urorin AR/VR, kwamfutoci, da wuraren aiki) suna ƙara mai da hankali kan sarrafa ƙarin bayanai a ƙananan wurare, duk da cewa an fi mai da hankali kan farashi. Marufi na semiconductor mai zurfi zai taka muhimmiyar rawa a wannan yanayin, kodayake hanyoyin marufi na iya bambanta da waɗanda ake amfani da su a HPC.
Lokacin Saƙo: Oktoba-07-2024