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Labaran Masana'antu: Samsung Zai Kaddamar da Sabis na Marufi na 3D HBM a 2024

Labaran Masana'antu: Samsung Zai Kaddamar da Sabis na Marufi na 3D HBM a 2024

SAN JOSE -- Kamfanin Samsung Electronics Co. zai ƙaddamar da ayyukan marufi masu girma uku (3D) don ƙwaƙwalwar ajiya mai girman bandwidth (HBM) cikin shekara, ana sa ran za a gabatar da fasaha don samfurin HBM4 na ƙarni na shida na guntuwar leƙen asiri ta wucin gadi wanda za a fara a shekarar 2025, a cewar kamfanin da majiyoyin masana'antu.
A ranar 20 ga watan Yuni, babbar kamfanin kera na'urar adana bayanai ta kwamfuta a duniya ta bayyana sabuwar fasahar tattara bayanai ta na'urar adana bayanai ta guntu da taswirar ayyukanta a taron Samsung Foundry Forum 2024 da aka gudanar a San Jose, California.

Wannan ne karo na farko da Samsung ta fitar da fasahar marufi ta 3D don kwakwalwan HBM a wani taron jama'a. A halin yanzu, kwakwalwan HBM galibi ana naɗe su ne da fasahar 2.5D.
Ya zo ne kimanin makonni biyu bayan da wanda ya kafa Nvidia kuma Babban Jami'in Gudanarwa Jensen Huang ya bayyana sabon tsarin tsarin dandamalin AI na Rubin a lokacin wani jawabi a Taiwan.
Ana sa ran HBM4 zai shiga cikin sabon tsarin Nvidia na Rubin GPU wanda ake sa ran zai fara kasuwa a shekarar 2026.

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HAƊIN TSAYE

Sabuwar fasahar marufi ta Samsung tana da kwakwalwan HBM da aka tara a tsaye a saman GPU don ƙara hanzarta koyon bayanai da sarrafa bayanai, wata fasaha da ake ɗauka a matsayin abin da ke canza yanayin kasuwar guntuwar AI mai saurin girma.
A halin yanzu, kwakwalwan HBM suna da alaƙa a kwance tare da GPU akan mai haɗa silicon a ƙarƙashin fasahar marufi ta 2.5D.

Idan aka kwatanta, marufi na 3D ba ya buƙatar mai haɗa silicon, ko siririn substrate wanda ke zaune tsakanin guntu don ba su damar sadarwa da aiki tare. Samsung ya kira sabuwar fasahar marufi da SAINT-D, a takaice don Samsung Advanced Interconnection Technology-D.

SABIS NA TURNKEY

An fahimci cewa kamfanin Koriya ta Kudu yana bayar da fakitin 3D HBM bisa tsarin aiki.
Domin yin hakan, ƙungiyar marufi mai ci gaba za ta haɗa kwakwalwan HBM da aka samar a sashin kasuwancin ƙwaƙwalwar ajiyarta da GPUs da aka haɗa don kamfanonin tatsuniya ta sashin gininta.

"Marufi na 3D yana rage yawan amfani da wutar lantarki da jinkirin sarrafawa, yana inganta ingancin siginar lantarki na kwakwalwan semiconductor," in ji wani jami'in Samsung Electronics. A shekarar 2027, Samsung na shirin gabatar da fasahar hadewa iri-iri wanda ke hada abubuwan gani wadanda ke kara saurin watsa bayanai na semiconductors cikin fakitin guda daya na masu saurin AI.

Dangane da karuwar bukatar kwakwalwan kwamfuta masu ƙarancin ƙarfi da inganci, ana hasashen cewa HBM za ta samar da kashi 30% na kasuwar DRAM a shekarar 2025 daga kashi 21% a shekarar 2024, a cewar TrendForce, wani kamfanin bincike na Taiwan.

Binciken MGI ya yi hasashen cewa kasuwar marufi mai ci gaba, gami da marufi na 3D, za ta karu zuwa dala biliyan 80 nan da shekarar 2032, idan aka kwatanta da dala biliyan 34.5 a shekarar 2023.


Lokacin Saƙo: Yuni-10-2024